THERMAL/POWER MANAGEMENT SOLUTIONS

Heat Sinks / Heavy Copper / Metal-Backed PCBs
– Production since 2003
– Hybrid or Teflon PCB’s
– Bonded to thick Copper pallets (1 mm – 5 mm)
– Experience with Pre-bonded, Post-bonded, Press fit, embedded and various coin designs
– Coin assembly by Bonding film, PSA, Embedded coin & Press fit
– Special team to support NPI and production.
–Used on Power Amplifiers and RF Modules
–Up to 12 oz. copper