Conventional PCBs

Up to 36 layers
High density designs
– Max thickness .180” (6.7 mm)
– Max panel size 24″ X 42” (612 mm x 1067 mm)
– Line/space to 3.0/3.0 mils (76 um/76 um, inner layers)
– Min core 1.0 mils (25.0 um)
– Via-In-Pad (POFV/VIPPO)
– Blind Press fit holes
– 0.2 mm drill size
Processes available
– LDI (laser Directing Imaging)
– 8 camera post-etch punch
– CCD Back-drilling
– Pattern plating process
– Copper thinning process
– Pulse plating process
Line Card PCB