Backplanes/Midplanes

Up to 64 layers
– Max thickness .374” (9.5 mm)
– Max panel size 24″ X 42” (612 mm x 1067 mm)
– Mid Ultra low Loss laminates
– Press fit holes
– Controlled impedance
Backdrilling
Multiple depths, both sides
Blind vias, Dual Vias, Air via
– Blind press-fit holes
– Cover PI-film on the surface
– Immersion Tin, OSP or ENIG
Reliability testing
– Thermal stress, IST, T-260
Backplane midplane products
Backdrilling / Blind Press fit hole